ISD25120PY

Single-Chip Voice Record/Playback Device, 28DIP, Single +5 volt power supply

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Price:: US $5.00~8.00 / piece [Get Latest Price]

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PartNumber:: ISD25120PY

Brand:: International Software Development (Shenzhen) Co. Ltd. - ISD | Pack: DIP | D/C: 11+

Availability:: Supply Ability: 10000/Week Can Ship Immediately
Delivery: 10-15 Business Days (ships out within 3 Business days)

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Total Price:: US $0

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Products Upload time: 2011-12-07

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Product Summary

The ISD25120PY is a Single-Chip Voice Record/Playback Device. It provides high-quality, single-chip Record/Playback solutions for 32- to 120-second messaging applications. The ISD25120PY includes an on-chip oscillator, microphone preamplifier, automatic gain control, antialiasing filter, smoothing filter, speaker amplifier, and high density multi-level storage array. In addition, the ISD25120PY is microcontroller compatible, allowing complex messaging and addressing to be achieved.

Parametrics

ISD25120PY absolute maximum ratings: (1)Junction temperature:150℃; (2)Storage temperature range:–65℃ to +150℃; (3)Voltage applied to any pin:(VSS – 0.3 V) to (VCC + 0.3 V); (4)Voltage applied to any pin(Input current limited to ±20 mA):(VSS – 1.0 V) to (VCC + 1.0 V); (5)Lead temperature (soldering – 10 seconds):300℃; (6)VCC - VSS:-0.3 V to + 7.0 V.

Features

ISD25120PY features: (1)Easy-to-use single-chip voice Record/Playback solution; (2)High-quality, natural voice/audio reproduction; (3)Manual switch or microcontroller compatible Playback can be edge- or level- activated; (4)Single-chip durations of 32*, 40*, 48*, 64*, 60, 75, 90, and 120 seconds ; (5)Directly cascadable for longer durations; (6)Automatic Power-Down (Push-Button Mode): Standby current 1μA(typical); (7)Zero-power message storage:Eliminates battery backup circuits; (8)Fully addressable to handle multiple messages; (9)100-year message retention (typical) ; (10)100,000 record cycles (typical); (11)On-chip clock source; (12)No algorithm development required; (13)Single +5 volt power supply; (14)Available in die form, DIP, SOIC, and TSOP packaging; (15)Industrial temperature (-40℃ to +85℃) versions available.